Method for cutting a member to form a desired structure

ABSTRACT

A method and apparatus for improved cutting of an object is provided. The object can take the form of many different structures including thin formations that require cutting precision, support, and dimensional control. In accordance with one example embodiment of the present invention, the method of cutting a member uses a laser and begins with the step of providing a template removably adhered to the member. The laser then projects through the template, without intersecting with the template, to cut the member and manufacture the desired formation. The laser does not intersect with, and therefore does not cut, the template structure and cause excess laser cutting dust.

FIELD OF THE INVENTION

[0001] The present invention relates to an improved method for cutting,and more particularly to the production of structures by laser cuttinglayers, or members of film or thin film structures.

BACKGROUND OF THE INVENTION

[0002] Many different structures often require the use of a laser to cutthrough a membrane, layer, or film, to form a desired formation. Oneexample field that requires the precision and other features of a laserfor cutting and forming these formations is the field ofmicroelectromechanical or microelectronic devices. Such devices oftenrequire cutting and transporting a delicate thin film structure from asource substrate to a new position on a target substrate. As such, anumber of different procedures have been developed for cutting andtransporting the thin film formations. For example, low tack adhesivesor methods utilizing electrostatic forces have been developed to enablethe formation and transportation of the thin film formations.

[0003] One known method for machining and attaching a thin filmformation is taught in U.S. Pat. No. 6,210,514 to Cheung et al., whichis incorporated herein by reference. The process of separating a thinfilm formation from the layer from which it has been cut, or from anadhesive transportation layer, can often deform, alter, stress, ordestroy the thin film structure undesirably. Defects ranging from slightdeformation or improper positioning, to major tears or structuraldeficiencies, can ultimately lead to the failure of themicroelectromechanical device into which the thin film formations areplaced.

[0004] The method of machining an attachment as described in the '514patent can be summarized as follows. A thin film is affixed to a lowtack polymeric membrane. While positioned on the polymeric membrane, thethin film is machined to define a thin film structure. This thin filmstructure (or array of thin film structures) is then separated from thepolymeric membrane in a mostly deformation-free state. In this manner,various target substrates, including glass, silicon, or printed circuitboards, can be equipped with mostly stress-free thin film structuressuitable for use in a wide variety of microelectromechanical ormicroelectronic devices.

[0005] However, structures that are cut through the low tack polymericmembrane still have significant stresses induced by edge contaminationresulting from the molten polymeric material, as well as from plasticdeformations that arise during delamination of the low tack polymericmembrane from the thin film structure. In addition, a collection of dustresults when the laser cuts through the low tack polymeric membrane.This laser cutting dust is a source of additional contamination for thethin film and the microelectromechanical device into which the thin filmultimately mounts. The collection of dust on the thin film can haveadverse affects on the functionality of the microelectromechanical ormicroelectronic devices. Further, once the laser cuts the low tackpolymeric membrane during the manufacture of the thin film formation, itis not possible to reuse the low tack polymeric membrane to cutadditional thin film structures to form like formations. Reusabilitywould promote reduced costs and improved efficiency.

SUMMARY OF THE INVENTION

[0006] There is a need in the art for an improved laser cutting methodand corresponding apparatus, for manufacturing structures such as thinformations that require laser cutting precision. The present inventionis directed toward further solutions to address this need.

[0007] In accordance with one example embodiment of the presentinvention, a method of cutting a member with a laser begins with thestep of providing the member. A template is then provided, and adheredto the member. The laser then projects through the template, withoutintersecting with the template, to cut the member and manufacture thedesired formation. The laser does not intersect with, and therefore doesnot cut, the template structure and cause excess laser cutting dust.

[0008] A member, according to one aspect of the present invention, canbe in the form of a film having multiple layers. One layer can be ametal layer and another layer can be a polymer layer. For example, themetal layer can be formed of aluminum and the polymer layer can beformed of polyester.

[0009] According to another aspect of the present invention, the step ofadhering the member to the template can include removably attaching thetemplate having low tack properties to a surface of the member throughcompression.

[0010] According to still another aspect of the present invention, thestep of projecting the laser through the template includes directing thelaser to pass through the template, without cutting the template, to cutthrough the member in a pattern corresponding to the template.

[0011] In accordance with one embodiment of the present invention, themethod further includes the step of transferring the member formationsto a removed location. The invention can further include the step ofremoving the template from the member in a manner such that the templateis reusable.

[0012] In accordance with still another embodiment of the presentinvention, a method of cutting a member with a laser is provided. Themethod includes providing the member, a template, and a base. The memberis sandwiched between the base and the template. A laser then projectsthrough the template, without intersecting the template, to cut themember and form one or more member formations.

[0013] In accordance with still another embodiment of the presentinvention, an assemblage includes a member and a template removablyadhering to the member. The template is suitable for accommodating alaser in cutting the member.

[0014] According to one aspect of the present invention, the member is afilm. The film can be formed of multiple layers, such as a metal layerand a polymer layer. The metal layer can be aluminum and the polymerlayer can be polyester.

[0015] According to another aspect of the present invention, thetemplate can include a layer having a predefined cut out sectionsuitable for accommodating the cutting of the member by the laser.

[0016] According to still another aspect of the present invention, thetemplate can have low tack properties and be removably attached to asurface of the member through compression. The template can further bereusable after being removed from the member.

BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The aforementioned features and advantages, and other featuresand aspects of the present invention, will become better understood withregard to the following description and accompanying drawings, wherein:

[0018]FIG. 1 is a polymeric member according to one aspect of thepresent invention;

[0019]FIG. 2 is a cross-sectional view of the thin film assembly of FIG.1 taken along line A-A;

[0020]FIG. 3 is a cross-section of a thin film assembly and polymericmember according to one aspect of the present invention;

[0021]FIG. 4 is a cross-section of the thin film assembly and twopolymeric members according to one aspect of the present invention;

[0022]FIG. 5 is a cross-section of the thin film assembly and twopolymeric members according to still another aspect of the presentinvention;

[0023]FIG. 6 is a cross-section of a stack assembly according to oneaspect of the present invention;

[0024]FIG. 7 is a cross-section of the thin film assembly sandwichedbetween two polymeric members according to a further aspect of thepresent invention;

[0025]FIG. 8 is the assembly of FIG. 7 with laser incisions according toone aspect of the present invention;

[0026]FIG. 9 is a cross-section of metal and polyester formations on anadhesive layer according another aspect of the present invention;

[0027]FIG. 10 is a cross-section of the assembly of FIG. 9 with anadhesive layer according to one aspect of the present invention;

[0028]FIG. 11 is a cross-section of the adhesive layer of FIG. 10 bondedto the formations according one aspect of the present invention;

[0029]FIG. 12 is a cross-section of the adhesive and formations bondingto a board according to a further aspect of the present invention;

[0030]FIG. 13 is a cross-section of the formations mounted on the boardaccording to the teachings of the present invention;

[0031]FIG. 14 is a cross-section of the thin film assembly sandwichbetween two polymeric members according to one aspect of the presentinvention;

[0032]FIG. 15 is a cross-section of the assembly of FIG. 14 withformations having fallen out and come to rest on a board according to afurther aspect of the present invention;

[0033]FIG. 16 is an alternative embodiment of a polymeric memberaccording to further aspects of the present invention;

[0034]FIG. 17 is a flowchart illustrating a cutting process inaccordance with one aspect of the present invention; and

[0035]FIG. 18 is a flowchart illustrating an additional cutting processin accordance with another aspect of the present invention.

DETAILED DESCRIPTION

[0036] An illustrative embodiment of the present invention relates to animproved method and apparatus for cutting a member with a laser. Inaccordance with the method of the present invention, the member, oftenin the form of a film or thin film, is affixed to a template. Thetemplate includes a plurality of apertures or patterns generally in theshape of desired formations to-be-cut into the member. The templateserves to support the member, especially a thin film member thatrequires additional support, and allows a laser to pass through theapertures of the template to directly cut the member without cutting thetemplate layer. The support provided by the template reduces the stresson the member, and more reliably holds the member in place prior to, andduring, cutting. In addition, the template provides access for the lasersuch that excess laser dust particles do not result from having to cutthrough the template layer in addition to the member. The reducedquantity of laser dust levels improves the overall quality of theresulting formations, and decreases the propensity of unwanted dustparticles to interfere with the transfer and use of the memberformations.

[0037]FIGS. 1 through 18, wherein like parts are designated by likereference numerals throughout, illustrate example embodiments of animproved laser cutting process and associated apparatus, according tothe teachings of the present invention. Although the present inventionwill be described with reference to the example embodiments illustratedin the figures, it should be understood that many alternative forms canembody the present invention. One of ordinary skill in the art willadditionally appreciate different ways to alter the parameters of theembodiments disclosed, such as the size, shape, or type of elements ormaterials, in a manner still in keeping with the spirit and scope of thepresent invention.

[0038]FIG. 1 illustrates a polymeric member 16, according to theteachings of the present invention. The polymeric member 16 is utilizedfor descriptive purposes herein. One of ordinary skill in the art willappreciate that the member can be made of a number of other materials,such as metal with a thin silicone tack layer, or bare plastic wheretacking is effected by electrostatic adhesion. The polymer member 16includes a first cut-out 24, a second cut-out 26, and third cut-out 28.The polymeric member 16 can be formed from a number of differentchemically inert polymeric materials. It is preferable for the polymericmember 16 to have low tack properties and be formed from, e.g.,polysiloxanes, polyurethanes, urethanes, styrenes, olefinics,copolyesters, polyamides, or other melt processible rubber materials.Two suitable materials are known as SYLGARD 184, manufactured by DowCorning Corp., and GEL-PAK, made by Vichem Corporation of Sunnyvale,Calif.

[0039] The first, second, and third representative cut-outs 24, 26, and28, represent openings in a polymeric member 16 that enable a laser topass through the polymeric member 16 without intersecting with, orcutting, the polymeric member 16. The laser passes through the polymericmember 16 to cut an object on an opposite side of the polymeric member16, as will be discussed later herein.

[0040] It should be noted that FIGS. 2 through 15 herein arecross-sectional views of the polymeric member 16 (and some alternativeforms and structures of the polymeric member 16) as viewed along thecross-section indicated by line A-A in FIG. 1.

[0041] A method of cutting as taught herein can be applied to a numberof different layers, members, films, surfaces, objects, and the like.However, for purposes of clarity in describing the invention, an exampleof a thin film assembly 10, as illustrated in FIG. 2, will be utilizedherein to describe the features and aspects of the present invention.The thin film assembly will be cut with a cutting element, in the formof a laser, however, other cutting elements can be utilized based inpart on what is being cut. One of ordinary skill in the art willunderstand that the teachings of the present invention are applicable toobjects other than thin film assemblies. In fact, the teachings of thepresent invention are applicable to a number of the identifiedstructures in addition to other known objects requiring laser cutting,such as metal foils, textiles, tissue, biological membranes, and thelike.

[0042]FIG. 2 illustrates the example thin film assembly 10. A metallayer 12 combines with a synthetic layer 14 to form the assembly 10. Thesynthetic layer can take the form of, e.g., MYLAR, which is availablefrom E. I. Du Pont de Nemours and Company Corporation of Wilmington,Del. The synthetic layer 14 provides support and insulation for the thinmetal layer 12 to reducing unwanted stresses on the metal layer 12.There are many other possible assemblies in the form of uniform orcomposite thin layers that can be handled in a same manner.

[0043] A cutting element in the form of a laser 36 (see FIG. 7) cuts thethin film assembly 10 into a desired number of pieces or formations.However, the stresses caused by the heat of the laser 36, and subsequenttransportation of the formations, makes it useful to have a polymericmember 16 as illustrated in FIG. 3. The polymeric member 16 adheres tothe top of the thin film assembly 10. The polymeric member 16 includesthe first cut-out 24, the second cut-out 26, and the third cut-out 28.Each of the cut-outs 24, 26, and 28 corresponds to desired patterns orshapes for the cutting of the thin film assembly 10.

[0044]FIGS. 4 and 5 illustrate alternative variations for additionalpolymeric members in the form of a polymeric base 18 adhered to a bottomof the thin film assembly 10. In FIG. 4, the polymeric base 18 is asolid structure that provides additional support to ease thetransportation of the thin film assembly 10 during the manufacturingprocess. The polymeric base 18 contains no apertures, and can have alow-tack surface for mildly adhering to the synthetic layer 14 of thethin film assembly 10.

[0045]FIG. 5 provides a second polymeric member 20 in addition to theoriginal polymeric member 16. The thin film assembly 10 is sandwichedbetween the first polymeric member 16 and the second polymeric member20. The second polymeric member 20 serves as a base structure similar tothe polymeric base 18 of FIG. 4. Contrary to the structure of the solidpolymeric member 18, the second polymeric member 20 includes acollection of apertures that pass through the second polymeric member20. The collection of apertures, in the form of a fourth cut-out 30, afifth cutout 32, and a sixth cut-out 34, are in substantially the sameshape and substantially the same location as the previously discussedfirst, second, and third cut-outs 24, 26, and 28. Thus, when thepolymeric member 16 is placed in alignment with the second polymericmember 20, the first, second, and third cut-outs 24, 26, and 28 matchsubstantially with the fourth, fifth, and sixth cut-outs 30, 32, and 34,to create apertures that pass completely through the combined polymericmember 16 and second polymeric member 20.

[0046] The cut-outs 24, 26, 28, 30, 32, and 34 allow a laser to passcompletely through the thin film assembly 10 sandwiched between thepolymeric members 16 and 20 without actually cutting, or making contactwith, either polymeric member 16 or 20. Alternatively, in the assemblyof FIG. 4, one must adjust the laser to stop cutting at the bottom edgeof the thin film assembly 10, just as the laser passes through the thinfilm assembly 10 to kiss-cut the polymeric base 18. The tackiness of thetwo support layer polymeric membranes 16 and 20 is beneficiallydifferent so that in peeling the first membrane 16, the thin filmremains adhered to the second membrane 20.

[0047] It should be noted that the actual structure of a number oflayers can vary as understood by one of ordinary skill in the art. Forexample, some layers could include different apertures or cut-outs thanothers. Some layers may be made of different materials from others. Somelayers may be larger or smaller than other layers. FIG. 6 illustrates,for example, a stack of layers similar to the arrangement of FIG. 5. InFIG. 6, eight thin film assemblies 10 stack with polymeric membersseparating each of the thin film assemblies 10. This forms a stack 22 ofpolymeric members in combination with thin film assemblies. Eachpolymeric member includes a first cut-out 24, a second cut-out 26, and athird cut-out 28. Therefore, the laser passing through the stack 22 canpass through each of the apertures 24, 26, and 28 without cutting thepolymeric member.

[0048] The overall arrangement and material selection can vary in waystoo numerous to detail, but such arrangements and material selectionsfall within the spirit and scope of the present invention.

[0049]FIGS. 7 and 8 illustrate a portion of the laser cutting processfor cutting the thin film assembly 10 into desired formations. The laser36 is directed as illustrated in a downward cutting direction along theperimeter of each of the first, second, and third cut-outs 24, 26, and28. The laser 36 does not come into contact with the polymeric member 16in FIG. 7, but it does kiss-cut the polymeric base 18 as it cuts throughthe metal layer 12 and the synthetic layer 14 of the thin film assembly10. The existence of each of the cut-outs 24, 26, and 28 makes itpossible for the laser to pass through the polymeric member 16, whilethe polymeric member 16 serves to provide the additional support to holdthe thin film assembly 10 in place during the cutting process and duringany subsequent transportation of the thin film assembly 10.

[0050]FIG. 8 illustrates the result after the laser 36 has cut throughthe thin film assembly 10. The laser passes through the first cut 24 andcuts through the metal layer 12 followed by the synthetic layer 14 andjust to the top edge of the polymeric base 18. The resulting laser cuts38 separate the thin film assembly 10 into the original metal layer 12and the synthetic layer 14, and the new metal layer formation 13 inconjunction with the new synthetic layer formation 15. Each of the metallayer and synthetic layer formations 13 and 15 are shown as threeseparate pieces in FIG. 8 surrounded by laser cuts 38.

[0051] The next step in the manufacturing process is often to remove theunwanted metal layer 12 and synthetic layer 14 of the original thin filmassembly 10, in addition to the polymeric member 16. FIG. 9 illustratesthe result of the removal of each of these unwanted elements, leavingmetal layer formation 13 and the synthetic layer formation 15 resting ontop of the polymeric base 18. The low tack properties of the polymericbase 18 helps to hold the metal layer formation 13 and the syntheticlayer formation 15 in place. As further described below, in the exampleembodiments illustrated in FIGS. 4, 5, and 6, the unwanted elements fall(or are blown) away when detached.

[0052]FIG. 10 illustrates a first step in the transportation process ofthe metal layer formation 13 and the synthetic layer formation 15 to adesired location. In this illustration, a transportation member 40, inthe form of an adhesive member, is compressed onto the surface of themetal layer formation 13. The adhesive forces between the transportationmember 40 are greater than those of the polymeric base 18. Therefore, asillustrated in FIG. 11, when the transportation member 40 raises, thesynthetic layer formation 15 peels off the polymeric base 18 and istransported with the transportation member 40.

[0053] The transporting member 40 then drops the metal layer formation13 and the synthetic layer formation 15 onto a desired location, such asa circuit board 44. Spot welds, or conducting adhesive, 42 bond themetal layer formation 13 and the synthetic layer formation 15 onto theboard 44. Then, as illustrated in FIG. 13, the transporting member 40peels off the metal layer formation 13 to leave the metal layerformation 13 and the synthetic layer formation 15 welded onto the board44 in desired locations.

[0054]FIG. 14 illustrates an alternative approach in accordance with theteachings of the present invention. The arrangement illustrated issimilar to that of FIG. 5, wherein there is a polymeric member 16 havingthe first, second, and third cut-outs 24, 26, and 28, in addition to thesecond polymeric member 20 having the fourth, fifth, and sixth cut-outs30, 32, and 34. The laser 36 makes the desired cuts to the assembly 10.

[0055]FIG. 15 illustrates the result of the laser cuts, wherein themetal layer formation 13 and the synthetic layer formation 15 drop fromthe metal layer 12 and the synthetic layer 14 location onto the board 44after being cut by the laser 36. The apertures, or cutouts, of thetemplates in the form of the polymeric member 16 and the secondpolymeric member 20 allow the formed portions 13 and 15 of the metallayer 12 and the synthetic layer 14 to fall directly onto the board 44without need for a transporting member 40. This arrangement greatlyreduces the added stresses on the thin film caused by the transportationof the metal layer formation 13 and the synthetic layer formation 15from the cutting location to the board 44. Once the metal layerformation 13 and the synthetic layer formation 15 have fallen to theboard 44, additional welds 42 can mount the metal layer formation 13 andthe synthetic layer formation 15 in place as previously depicted in FIG.13.

[0056]FIG. 16 illustrates still another embodiment of the presentinvention, wherein a polymeric member 46 includes a variety of differentcut-outs 48 forming individual flaps 50. One of ordinary skill in theart will understand and appreciate that any number of differentpatterns, such as the one illustrated in FIG. 16 and the other figuresherein, can be executed to result in a variety of different patterns andshapes for the thin film formations.

[0057] As understood by one of ordinary skill in the art, a number ofdifferent cutting tools can be utilized to cut the metal and syntheticlayers 12 and 14, such as various mechanical, electrical, chemical,acoustical, or optical technologies. Some cutting techniques that can beused in conjunction with the templates of the polymeric members 16 asutilized herein can include stamping, die cutting, kiss-cutting,shearing, punching, breaking, forming, bending, forging, coming, and thelike. Electrical technologies can further include electrical dischargemachining using high frequency electric sparks. Chemical technologiescan include chemical/mechanical polishing, electromechanical machining,electrolytic grinding, electrochemical arc machining, and acidelectrolyte capillary drilling. Acoustic technologies can includeultrasonic machining, ultrasonic twist drilling, and other opticaltechniques such as laser cutting and drilling.

[0058] The present invention is particularly useful in conjunction withthe laser cutting of fragile thin films and thin film assemblies. Thethin films can be organic, inorganic, or composite. Thin films aregenerally extremely sensitive to different applied stresses. Actionssuch as handling and processing of the thin films often have thepotential to cause wrinkling, creasing, scratching, stretching,contamination, and added residual stressing. Any of these differentactions can permanently damage the thin film. Lamination of the thinfilm with the polymeric members greatly reduces the potential for thisdamage to occur.

[0059] The polymeric member as described herein can be made of anynumber of different materials for supporting the thin film assemblies.The polymeric member can be formed of various chemically inert polymericmaterials, and can be used in cross link or gel form. Some embodimentsmay require the use of substantially transparent, or transparent,polymeric members. It is preferable to utilize low tack elastomericmembranes to aid the members in adhering to the films. However, bareplastic, metal, or layered structures, such as metal with a thinsilicone layer, can be used as support members. The support members canbe flexible and dimensionally stable, or non-stretchable.

[0060] Typically, the synthetic layer of the thin film assembly, whichadds additional support to the metal layer, has a thickness on the orderof 10 microns for supporting a metal layer having a thickness on theorder of 0.1 microns. One of ordinary skill in the art will appreciatethat in addition to polyester or aluminum thin films (which are mostcommon), films based on other polymers including organic polymers suchas polyethylene, polystyrene, polyamides, polyimides, and the like canbe used. Some embodiments may additionally require the use of inorganicpolymers such as silanes, or other silicones. Some microelectronic andmicroelectromechanical devices require the use of glass orpolycrystalline films, silica wafers, or other crystalline materialscommonly used in the semiconductor processing industry. Conductive metalfilms such as chromium, copper, tin, or gold can also be utilized inaddition to a number of nonconductive dielectric films. Uniform thinmetal foils without polymer layers, polymer films without metal foils,biological membranes, or the like, can be handled in a similar manner.

[0061] A typical laser utilized for the laser cutting of the thin filmassemblies as described herein, can be a conventional 50 watts infraredcarbon dioxide laser operated at about 10 watts with a 200 micron beamdiameter near focus. During the laser cutting process, the thin filmassembly is ablatively heated and evaporated to leave the laser cuts.Only the thin film assembly is cut in accordance with the presentinvention, not the template in the form of the polymeric member.

[0062] A suitable adhesive for forming the transporting member 40 can beScotch 467 MP high performance adhesive manufactured by 3M Corporation.As previously mentioned, an assortment of particulates and dust thatcollects from the laser cutting of the thin film assembly represent aquality control issue. With the use of a polymeric member 16, and 20,the amount of material cut by the laser is significantly reduced,thereby significantly reducing the amount of leftover laser cuttingdust. This greatly decreases the quality control issues surroundingcontamination by particulate matter. The added support of the templatein the form of the polymeric member 16, 20, also provides the requiredsupport for transporting the thin film assembly as desired.

[0063] In addition, the shape of the cut-outs in the templates orpolymeric members 16, 20 can vary substantially. The shapes can closelymimic the desired formations, or they can be more generously portioned.The shapes can, for example, follow the exact lines of the desiredformations, with a predetermined border. Alternatively, the shapes cansimply provide openings in the general shape of, e.g., a square,rectangle, circle, and the like, with the laser cutting a more uniqueshape in the thin film within the boundaries of the template cut-outs.

[0064] Referring to FIGS. 17 and 18, in operation, the object to-be-cut(e.g., the thin film assembly 10) is sandwiched between a pre-cuttemplate (in the form of, e.g., polymeric member 16) and a base member(in the form of, e.g., polymeric base 18) (step 60). A cutting device,(e.g., a laser 36) passes through apertures in the template, cutsdesired patterns or shapes in the thin film assembly 10, and kiss-cutsthe base member (step 62). Unwanted portions of the template and thethin film assembly are removed (step 64). A transportation member,(e.g., an adhesive coated member) compresses against the cut-outportions of the thin film assembly, and lifts the portions off the basemember (step 66). The transportation member moves the cut-out portionsto a desired location (step 68) and lowers the cut-out portions to,e.g., a board. The cut-out portions are fixed to the board by, forexample, a welding process (step 70), and the transportation memberpeels off the cut-out portions that are now mounted in place (step 72).

[0065]FIG. 18 illustrates an alternative method in accordance with theteachings of the present invention. First, the object is sandwichedbetween a template and a base containing the same cut-out sections asthe template (as depicted in FIG. 14) (step 74). The cutting devicepasses through the apertures of the top template, and also through theapertures of the bottom base, while cutting the object in-between (step76). The cut-out portions of the object drop to a board positioned belowthe thin film assembly (step 78), and the cut-out portions can be fixedto the board as desired (80).

[0066] Numerous modifications and alternative embodiments of the presentinvention will be apparent to those skilled in the art in view of theforegoing description. Accordingly, this description is to be construedas illustrative only and is for the purpose of teaching those skilled inthe art the best mode for carrying out the present invention. Details ofthe structure may vary substantially without departing from the spiritof the present invention, and exclusive use of all modifications thatcome within the scope of the appended claims is reserved. It is intendedthat the present invention be limited only to the extent required by theappended claims and the applicable rules of law.

What is claimed is:
 1. A method of cutting a member, comprising thesteps of: adhering the member to a template; and projecting a cuttingelement through the template, without intersecting with the template, tocut the member.
 2. The method according to claim 1, wherein the cuttingelement is a laser.
 3. The method according to claim 1, wherein themember comprises a multi-layered film.
 4. The method according to claim3, wherein the multi-layered film comprises supplying a metal layer anda polymer layer.
 5. The method according to claim 3, wherein themulti-layered film comprises aluminum and polyester.
 6. The methodaccording to claim 1, further comprising the step of providing atemplate having pre-defined cut-out sections for accommodating thecutting of the member by the laser.
 7. The method according to claim 1,wherein the step of adhering comprises the step of removably attachingthe template having low tack properties to a surface of the memberthrough one of compression and contact.
 8. The method according to claim1, wherein contact electrostatic binding removably adheres the member tothe template.
 9. The method according to claim 1, wherein the step ofprojecting comprises the step of directing the cutting element to passthrough the template, without cutting the template, to cut through themember in a pattern corresponding to the template.
 10. The methodaccording to claim 1, further comprising the step of transferring memberformations, formed by the cutting element, to a separate location. 11.The method according to claim 1, further comprising the step of removingthe template from the member in a manner such that the template isre-usable.
 12. A method of cutting a member with a laser, comprising thesteps of: sandwiching the member between a base and a template; andprojecting the laser through the template, without intersecting thetemplate, to cut the member and form one or more member formations. 13.The method according to claim 12, wherein the member comprises amulti-layered film.
 14. The method according to claim 13, wherein themulti-layered film comprises aluminum and polyester.
 15. The methodaccording to claim 12, further comprising supplying a template havingpre-defined cut-out sections for accommodating the cutting of the memberby the laser.
 16. The method according to claim 12, wherein the step ofproviding the base comprises supplying a solid layer for supporting themember and the one or more member formations.
 17. The method accordingto claim 12, wherein the step of providing the base comprises supplyinga layer having pre-defined cut-out sections.
 18. The method according toclaim 12, wherein the step of projecting comprises directing the laserto pass through the template, without cutting the template, to cutthrough the member in a pattern corresponding to the template.
 19. Themethod according to claim 12, further comprising the step of removingthe template from the member in a manner such that the template isre-usable.
 20. The method according to claim 12, further comprising thestep of removing the base from the member.
 21. An assemblage produced bysandwiching a member between a base and a template, and projecting thelaser through the template, without intersecting the template, to cutthe member and form one or more member formations, the assemblagecomprising: the member; and the template removably adhering to themember; wherein the template is suitable for accommodating the laser incutting the member.
 22. The assemblage according to claim 19, whereinthe member is a multi-layer film.